Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16979165
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Filing Dt:
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09/08/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Inventors:
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Arisa SHIRAISHI, Naoto OZAWA, Takayuki SUZUKI, Mitsuyasu FURUSAWA
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Title:
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FLUX, SOLDER PASTE, SOLDERING PROCESS, METHOD FOR PRODUCING SOLDERED PRODUCT, AND METHOD FOR PRODUCING BGA PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-3-27, SAKAWA, SAKURA-KU |
| SAITAMA-SHI |
| SAITAMA, JAPAN 338-0823 |
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| 32-1, SENJU ASAHI-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-0026 |
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| SQUIRE PB (SFR OFFICE) |
| 275 BATTERY STREET, SUITE 2600 |
| SAN FRANCISCO, CA 94111-3356 |
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