Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17020532
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Filing Dt:
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09/14/2020
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Publication #:
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Pub Dt:
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12/31/2020
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Inventors:
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Takumi TOIDA, Takashi MAKINOSHIMA, Masatoshi ECHIGO, Youko SHIMIZU, Takashi SATO
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Title:
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COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8324 |
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| FITCH EVEN TABIN & FLANNERY, LLP |
| 120 SOUTH LASALLE STREET |
| SUITE 2100 |
| CHICAGO, IL 60603-3406 |
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