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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/03/2022
Application #:
16456650
Filing Dt:
06/28/2019
Publication #:
Pub Dt:
12/31/2020
Inventors:
Jamaica LaQuay Barnette, Douglas Evans, Dipak Tailor, Brian Christopher Totten
Title:
SYSTEMS AND METHODS FOR COOLING COMPUTING DEVICE EXPANSION MODULES BASED ON AIRFLOW RATES
Assignment: 1
Reel/Frame:
049649/0283Recorded: 07/02/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/28/2019
Exec Dt:
06/27/2019
Exec Dt:
07/01/2019
Exec Dt:
06/27/2019
Assignee:
151, LORONG CHUAN
#02-01
NEW TECH PARK, SINGAPORE 556741
Correspondent:
OLIVE LAW GROUP
125 EDINBURGH SOUTH DRIVE
SUITE 220
CARY, NC 27511

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