Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16453895
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Filing Dt:
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06/26/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Inventors:
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Jeremy Ecton, Brandon Marin, Leonel Arana, Hongxia Feng
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Title:
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INTEGRATED CIRCUIT PACKAGE ASSEMBLIES WITH HIGH-ASPECT RATIO METALLIZATION FEATURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| GREEN, HOWARD, & MUGHAL LLP. |
| 5 CENTERPOINTE DRIVE |
| SUITE 400 |
| LAKE OSWEGO, OR 97035 |
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