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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/26/2022
Application #:
17019303
Filing Dt:
09/13/2020
Publication #:
Pub Dt:
12/31/2020
Inventors:
Wenliang Chen, Lin Ma, Alessandro Minzoni
Title:
METHOD OF ASSEMBLING MICROELECTRONIC PACKAGE AND METHOD OF OPERATING THE SAME
Assignment: 1
Reel/Frame:
053754/0054Recorded: 09/13/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/20/2018
Exec Dt:
12/18/2018
Exec Dt:
12/20/2018
Assignee:
10F-1 NO. 1, TAIYUAN 1ST STREET
ZHUBEI CITY
HSINCHU COUNTY, TAIWAN 30288
Correspondent:
HUFFMAN LAW GROUP, P.C.
6925 SNOW MASS DR.
COLORADO SPRINGS, CO 80908

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