Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/01/2022
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Application #:
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17018733
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Filing Dt:
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09/11/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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Po-Kuan HO, Chia-Tien WU
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Title:
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Method for Manufacturing an Interconnect Structure having a Selectively Formed Bottom Via
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE RD. |
| SUITE 100 EAST |
| FALLS CHURCH, VA 22042 |
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