Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/27/2022
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Application #:
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17019026
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Filing Dt:
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09/11/2020
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Publication #:
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Pub Dt:
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01/14/2021
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Inventors:
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Tao-Chih CHANG, Yu-Min LIN
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Title:
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CHIP SCALE PACKAGE STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG |
| HSINCHU, TAIWAN 31057 |
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| NELSON QUINTERO |
| 615 HAMPTON DRIVE SUITE A202 |
| VENICE, CA 90291 |
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