Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17033704
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Filing Dt:
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09/26/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Inventors:
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Kohei SUZUKI, Toshiaki MARUICHI
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Title:
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THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-10, FUKUURA, KANAZAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVENUE |
| SUITE 1010 |
| NEW YORK, NY 10036-3744 |
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