Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16936262
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Filing Dt:
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07/22/2020
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Publication #:
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Pub Dt:
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01/28/2021
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Inventors:
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Royal Wallace Cherry III, Omied Surendra Lele, Bernardo Gonzalez et al
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Title:
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Systems and Methods for Horizontal Wafer Packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 48625 WARM SPRINGS BLVD. |
| FREMONT, CALIFORNIA 94539 |
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| STEVENS LAW GROUP |
| 1754 TECHNOLOGY DRIVE |
| SUITE #226 |
| SAN JOSE, CA 95110 |
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