Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2022
|
Application #:
|
16924771
|
Filing Dt:
|
07/09/2020
|
|
Publication #:
|
|
Pub Dt:
|
01/28/2021
| | | | |
|
Inventors:
|
Hideyuki MURAYAMA, Tomo SASAKI
|
|
Title:
|
SEMICONDUCTOR MODULE STRUCTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
|
|
|
|
| EE MING T. BAHK |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
|
|
|
|
| EE MING T. BAHK |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
|
|
Search Results as of:
04/28/2024 04:33 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
