Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16500171
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Filing Dt:
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10/02/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventors:
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Kouki Oomori, Ayaka Tsuchiya, Yukihiko Hirai, Mitsuhiro Isumi
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Title:
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SOLDER MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26-2, NISHISHINJUKU 1-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 163-0539 |
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| RANKIN HILL AND CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT SPELLING OF SECOND ASSIGNOR PREVIOUSLY RECORDED AT REEL: 050601 FRAME: 0704. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 26-2, NISHISHINJUKU 1-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 163-0539 |
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| RANKIN HILL AND CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2520, TAKABA |
| HITACHINAKA-SHI, IBARAKI, JAPAN |
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| RANKIN, HILL & CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
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