Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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16584425
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Filing Dt:
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09/26/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventors:
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Hongsheng YI, Zhijun ZHANG, Yifan YANG
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Title:
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Grinding Control Method And Device For Wafer, And Grinding Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18, GAOXIN 4TH ROAD |
| DONGHU DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430205 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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