Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/09/2021
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Application #:
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16527552
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Filing Dt:
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07/31/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventor:
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Michael A. Smith
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Title:
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ISOLATION STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 SOUTH FEDERAL WAY |
MS 525 |
BOISE, IDAHO 83716 |
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DICKE, BILLIG & CZAJA, PLLC - MICRON |
100 SOUTH FIFTH STREET |
SUITE 2250 |
MINNEAPOLIS, MN 55402 |
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