Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/27/2021
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Application #:
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16585792
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Filing Dt:
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09/27/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventor:
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CHIH-CHIEH FU
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Title:
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MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| QINHUANGDAO, CHINA |
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| B1DG A1-A3, AVARY PARK, SONGLUO RD.,,YANCHUAN COMMUNITY, YANLUO ST., BAO AN DIST., |
| SHENZHEN, CHINA |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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