Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16533590
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Filing Dt:
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08/06/2019
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Publication #:
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Pub Dt:
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02/11/2021
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Inventors:
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Jungrae Park, Zavier Zai Yeong Tan, James S. Papanu
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Title:
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HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW FIFTH AVENUE |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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