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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/20/2022
Application #:
17086820
Filing Dt:
11/02/2020
Publication #:
Pub Dt:
02/18/2021
Inventors:
Jian Hua SUN, Sizhe LI, Ji XIA, Qinxiang WEI
Title:
STRUCTURES AND METHODS FOR REDUCING STRESS IN THREE-DIMENSIONAL MEMORY DEVICE
Assignment: 1
Reel/Frame:
054245/0017Recorded: 11/02/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/12/2019
Exec Dt:
07/12/2019
Exec Dt:
07/12/2019
Exec Dt:
07/12/2019
Assignee:
NO. 88 WEILAI 3RD ROAD
EAST LAKE HIGH-TECH DEVELOPMENT ZONE
WUHAN, HUBEI, CHINA 430000
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
1100 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20005

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