Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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17094356
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Filing Dt:
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11/10/2020
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Publication #:
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Pub Dt:
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02/25/2021
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Inventors:
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Borna J. Obradovic, Titash Rakshit, Mark S. Rodder
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Title:
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HIGH-DENSITY NEUROMORPHIC COMPUTING ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| LEWIS ROCA ROTHGERBER CHRISTIE LLP |
| PO BOX 29001 |
| GLENDALE, CA 91209 |
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