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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/28/2022
Application #:
16811481
Filing Dt:
03/06/2020
Publication #:
Pub Dt:
02/25/2021
Inventors:
Sung Lae OH, Dong Hyuk KIM, Tae Sung PARK
Title:
SEMICONDUCTOR MEMORY DEVICE WITH CHIP-TO-CHIP BONDING STRUCTURE
Assignment: 1
Reel/Frame:
052039/0875Recorded: 03/06/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/04/2020
Exec Dt:
03/04/2020
Exec Dt:
03/04/2020
Assignee:
2091, GYEONGCHUNG-DAERO, BUBAL-EUB
GYEONGGI-DO
ICHEON-SI, KOREA, REPUBLIC OF 17336
Correspondent:
AGORA LAW, LLC
14711 NE 29TH PLACE
SUITE 200
BELLEVUE, WA 98007

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