Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17098754
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Filing Dt:
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11/16/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Inventors:
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Robert Alan May, Sri Ranga Sai Boyapati, Kristof Kuwawi Darmawikarta et al
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Title:
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PACKAGE SUBSTRATE WITH HIGH-DENSITY INTERCONNECT LAYER HAVING PILLAR AND VIA CONNECTIONS FOR FAN OUT SCALING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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ALISHA FEUSTEL |
2816 LAGO VISTA LANE |
PATENT CAPITAL GROUP |
ROCKWALL, TX 75032 |
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06/14/2024 08:24 AM
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