Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/05/2021
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Application #:
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16565064
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Filing Dt:
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09/09/2019
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Publication #:
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Pub Dt:
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03/11/2021
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Inventors:
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Chien-Fan CHEN, Yu-Ju LIAO
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Title:
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EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811 |
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| INNOVATION COUNSEL LLP |
| 2890 ZANKER ROAD, SUITE 200 |
| SAN JOSE, CA 95134 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, NW |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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