Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/30/2022
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Application #:
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17095856
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Filing Dt:
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11/12/2020
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Publication #:
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Pub Dt:
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03/18/2021
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Inventors:
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Robert Edward Higashi, Son Thai Lu, Elenita Malasmas Chanhvongsak
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Title:
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THROUGH SILICON VIA FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 303 S TECHNOLOGY COURT |
| BROOMFIELD, COLORADO 80021 |
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| ALSTON & BIRD LLP/CHRISTOPHER TL DOUGLAS |
| BANK OF AMERICA PLAZA, 101 S. TRYON ST. |
| SUITE 4000 |
| CHARLOTTE, NC 28280-4000 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 115 TABOR ROAD |
| MAIL STOP: 4D3 |
| MORRIS PLAINS, NEW JERSEY 07950 |
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| SCHWEGMAN LUNDBERG & WOESSNER P.A. |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 303 S TECHNOLOGY COURT |
| BROOMFIELD, COLORADO 80021 |
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| ALSTON & BIRD LLP/CHRISTOPHER TL DOUGLAS |
| BANK OF AMERICA PLAZA, 101 S. TRYON ST. |
| SUITE 4000 |
| CHARLOTTE, NC 28280-4000 |
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