Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16578648
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Filing Dt:
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09/23/2019
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Publication #:
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Pub Dt:
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03/25/2021
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Inventor:
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Stefan Steinhoff
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Title:
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SEMICONDUCTOR CHIP CONTACT STRUCTURE, DEVICE ASSEMBLY, AND METHOD OF FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8755 WEST HIGGINS ROAD, SUITE 500 |
CHICAGO, ILLINOIS 60631 |
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KACVINSKY DAISAK BLUNI PLLC (1511) |
101 CARNEGIE CENTER |
SUITE 106 |
PRINCETON, NJ 08540 |
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06/08/2024 12:43 AM
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