Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16579577
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Filing Dt:
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09/23/2019
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Devesh Kumar Datta, David Daycock, Keen Wah Chow, Tom George, Justin B. Dorhout et al
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Title:
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Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with Silicon
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY, MS 1- 525 |
| BOISE, IDAHO 83716 |
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| WELLS ST. JOHN P.S. |
| 601 W. MAIN AVENUE |
| SUITE 600 |
| SPOKANE, WA 99201 |
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