Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/18/2022
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Application #:
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16854704
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Filing Dt:
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04/21/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Dong Young PYEON, Sung Il KANG, Jong Hoe KU, In Seob BAE
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Title:
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METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 726, UNGNAM-RO, SEONGSAN-GU |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 51552 |
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| MARIA LINDA SCARDINA |
| 1211 SW FIFTH AVENUE, SUITE 1900 |
| SCHWABE, WILLIAMSON & WYATT, P.C. |
| PORTLAND, OR 97204 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 726, UNGNAM-RO, SEONGSAN-GU |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 51552 |
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| MARIA LINDA SCARDINA |
| 1211 SW FIFTH AVENUE, SUITE 1900 |
| SCHWABE, WILLIAMSON & WYATT, P.C. |
| PORTLAND, OR 97204 |
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