Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2022
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Application #:
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16869594
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Filing Dt:
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05/08/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Inventors:
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Lawrence Chiang Sheu, Chen-Hua Yu, Tung-Liang Shao, Chih-Hang Tung, Yi-Li Hsiao
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Title:
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SEMICONDUCTOR COMPONENT WITH COOLING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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