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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16963182
Filing Dt:
07/17/2020
Publication #:
Pub Dt:
04/29/2021
Inventors:
Ying-shu Quan, Fumio Kamiyama
Title:
TIGHT-BINDING DEVICE FOR MICRO-NEEDLE
Assignment: 1
Reel/Frame:
053245/0950Recorded: 07/17/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/10/2020
Exec Dt:
06/10/2020
Assignee:
32, KAWANISHI-CHO, HIGASHIKUJO, MINAMI-KU
KYOTO-CITY, KYOTO, JAPAN 601-8014
Correspondent:
LEE CHENG
1133 13TH STREET N.W. STE C2
WASHINGTON, DC 20005

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