Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17073466
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Filing Dt:
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10/19/2020
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Publication #:
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Pub Dt:
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04/29/2021
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Inventors:
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NAOMICHI OHASHI, YASUHIRO OKAWA, KOSO MATSUNO
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Title:
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SOLDER PASTE AND JOINING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 540-6207 |
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| PASONA KNOWLEDGE PARTNER INC. |
| 8F OBP PANASONIC TOWER |
| 1-61, SHIROMI 2-CHOME, CHUO-KU |
| OSAKA, 540-6208 JAPAN |
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05/16/2024 07:42 PM
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