Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17102137
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Filing Dt:
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11/23/2020
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Publication #:
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Pub Dt:
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04/29/2021
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Inventor:
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Tadashi Okada
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Title:
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SEALING STRUCTURE FOR COOLING DEVICE AND COOLING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-38-5 NISHISHIMBASHI, MINATO-KU |
| TOKYO, JAPAN 105-8433 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, NW |
| WASHINGTON, DC 20001 |
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