Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17140143
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Filing Dt:
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01/04/2021
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Publication #:
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Pub Dt:
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04/29/2021
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Inventors:
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Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
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Title:
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Packaging Structure of a Magnetic Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.2, RESEARCH & DEVELOPMENT 2ND RD., SCIENCE PARK |
| HSINCHU, TAIWAN |
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| MIN-LEE TENG |
| 11F-2, NO. 248, SEC.3, NAN-JING E. RD. |
| TAIPEI, 105 TAIWAN |
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05/23/2024 04:11 AM
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