Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/28/2024
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Application #:
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16825166
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Filing Dt:
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03/20/2020
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Publication #:
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Pub Dt:
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05/06/2021
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Inventors:
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Chun-Yuan Huang, Wei-Chun Hsueh
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Title:
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BONDING DEVICE, BONDING STRUCTURE FOR WEARABLE DEVICE AND NODE DEVICE FOR FORMING SENSING POINT ON SIGNAL CONNECTING LINE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| B2, 3F, NO. 1, LI-HSIN 1ST RD., SCIENCE PARK |
| HSINCHU CITY 300, TAIWAN R.O.C. |
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| DARIUSH ADLI |
| 700 SOUTH FLOWER STREET, |
| LOS ANGELES, CA 90017 |
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