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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/14/2021
Application #:
16319639
Filing Dt:
01/22/2019
Publication #:
Pub Dt:
05/20/2021
Inventors:
Daigo HIRAKAWA, Masanori TAKANASHI, Isao IIDA, Kenji TAKENAKA, Eiji TANIGAWA
Title:
THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION
Assignment: 1
Reel/Frame:
048092/0177Recorded: 01/22/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Assignee:
2-20, AKASAKA 5-CHOME
MINATO-KU, TOKYO, JAPAN 107-6119
Correspondent:
HOLTZ, HOLTZ, & VOLEK PC
630 NINTH AVENUE, SUITE 1010
NEW YORK, NY 10036-3744
Assignment: 2
Reel/Frame:
056750/0493Recorded: 02/23/2021Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE FROM MIKASA SANGYO CO., LTD TO MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC PREVIOUSLY RECORDED ON REEL 048092 FRAME 0177. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Exec Dt:
01/07/2019
Assignee:
2-20, AKASAKA 5-CHOME
MINATO-KU, TOKYO, JAPAN 107-6119
Correspondent:
HOLTZ, HOLTZ & VOLEK PC
630 9TH AVENUE
SUITE 1010
NEW YORK, NY 10036

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