Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16718034
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Filing Dt:
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12/17/2019
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Publication #:
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Pub Dt:
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06/17/2021
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Inventors:
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Chien-Hsun Lee, Hao-Cheng Hou, Tsung-Ding Wang, Jung-Wei Cheng, Chi-Yang Yu, Hsin-Yu Pan
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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