Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17110092
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Filing Dt:
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12/02/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Inventors:
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Hye Jin Kim, Kyu Yeon Hwang, Hyun Yeong Jung, Jin Ho Lee, Seung Pill Jung
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Title:
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HOT STAMPING COMPONENT AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 63, JUNGBONG-DAERO |
| DONG-GU |
| INCHEON, KOREA, REPUBLIC OF 22525 |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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