Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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16718213
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Filing Dt:
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12/18/2019
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Publication #:
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Pub Dt:
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06/24/2021
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Inventors:
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Hung-Jui Kuo, Sih-Hao Liao, Ting-Chen Tseng, Yu-Hsiang Hu
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Title:
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PACKAGE STRUCTURE WITH SOLDER RESIST UNDERLAYER FOR WARPAGE CONTROL AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 300-78 |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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09/26/2024 09:51 AM
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