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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/08/2022
Application #:
16728983
Filing Dt:
12/27/2019
Publication #:
Pub Dt:
07/01/2021
Inventors:
Cheng-Ying Huang, Gilbert Dewey, Ashish Agrawal, Kimin Jun, Willy Rachmady et al
Title:
THREE-DIMENSIONAL INTEGRATED CIRCUITS (3DICS) INCLUDING BOTTOM GATE MOS TRANSISTORS WITH MONOCRYSTALLINE CHANNEL MATERIAL
Assignment: 1
Reel/Frame:
051670/0310Recorded: 01/30/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/17/2020
Exec Dt:
01/20/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/21/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/23/2020
Exec Dt:
01/21/2020
Exec Dt:
01/17/2020
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
GREEN, HOWARD, & MUGHAL LLP
5 CENTERPOINTE DR.
LAKE OSWEGO, OR 97035

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