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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/26/2021
Application #:
16736077
Filing Dt:
01/07/2020
Publication #:
Pub Dt:
07/08/2021
Inventors:
Jesus Mennen Belonio JR., Duncan Barclay, Edward Horsburgh
Title:
Modular WLCSP Die Daisy Chain Design for Multiple Die Sizes
Assignment: 1
Reel/Frame:
058163/0833Recorded: 11/17/2021Pages: 9
Conveyance:
EMPLOYMENT AGREEMENT
Assignor:
Exec Dt:
01/14/2003
Assignee:
TOWER BRIDGE HOUSE
ST. KATHARINE'S WAY
LONDON, UNITED KINGDOM E1W 1AA
Correspondent:
SAILE ACKERMAN LLC
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603
Assignment: 2
Reel/Frame:
057351/0560Recorded: 09/01/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/26/2020
Exec Dt:
12/20/2019
Assignee:
TOWER BRIDGE HOUSE
ST. KATHARINE'S WAY
LONDON, UNITED KINGDOM E1W 1AA
Correspondent:
SAILE ACKERMAN LLC
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603

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