Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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17148642
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Filing Dt:
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01/14/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Inventors:
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Chia-Feng Wu, Lien-Kai Chou, Cheng-Mou Tsai, Chao-Hung Chang, Jhan-Jhang Liao et al
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Title:
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PAIRING AND INTERCONNECTING METHOD BETWEEN ELECTRONIC DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F., NO.157, DA-AN RD., TUCHENG DIST. |
NEW TAIPEI CITY, TAIWAN |
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MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE SE |
SUITE 550 |
ATLANTA, GA 30339 |
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09/25/2024 02:46 AM
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