Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17147908
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Filing Dt:
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01/13/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Inventors:
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John Bultitude, Peter Alexandre Blais, James A. Burk, Galen W. Miller, Hunter Hayes et al
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Title:
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Component Assemblies and Embedding for High Density Electronics
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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KEMET TOWER |
ONE EAST BROWARD BLVD. 2ND FLOOR |
FORT LAUDERDALE, FLORIDA 33301 |
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PATENT FILING SPECIALIST INC. |
16 WELLINGTON AVE. |
GREENVILLE, SC 29609 |
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06/20/2024 08:21 PM
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