Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17225491
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Filing Dt:
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04/08/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Inventors:
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Chong MEI, Raj KUMAR, Michael LEN, Michael LUGERT
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Title:
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METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200 EAST SANDPOINTE |
| SUIE 400 |
| SANTA ANA, CALIFORNIA 92707 |
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| POLSINELLI PC |
| 105 WEST VANDALIA STREET |
| SUITE 400 |
| EDWARDSVILLE, IL 62025 |
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Assignment:
2
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PATENT SECURITY AGREEMENT (ABL)
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| 10 S. DEARBORN |
| FLOOR L2 |
| CHICAGO, ILLINOIS 60603 |
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| COURTNEY WELSHIMER |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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Assignment:
3
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PATENT SECURITY AGREEMENT (TERM LOAN)
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| 10 S. DEARBORN |
| FLOOR L2 |
| CHICAGO, ILLINOIS 60603 |
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| COURTNEY WELSHIMER |
| 425 LEXINGTON AVENUE |
| NEW YORK, NY 10017 |
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09/22/2024 04:07 AM
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