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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17161278
Filing Dt:
01/28/2021
Publication #:
Pub Dt:
07/29/2021
Inventors:
Frank Gindele, Christian Rakobrandt, Kazuhito Miyawaki, Robert Hettler, Takahisa Uchida
Title:
METHOD FOR PRODUCING GLASS WAFERS FOR PACKAGING ELECTRONIC DEVICES, AND ELECTRONIC COMPONENT PRODUCED ACCORDING TO THE METHOD
Assignment: 1
Reel/Frame:
055754/0365Recorded: 03/29/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/21/2021
Exec Dt:
01/21/2021
Exec Dt:
02/17/2021
Exec Dt:
01/21/2021
Exec Dt:
01/22/2021
Assignee:
HATTENBERGSTRASSE 10
MAINZ, GERMANY 55122
Correspondent:
CHARLES N. J. RUGGIERO
OHLANDT, GREELEY, RUGGIERO & PERLE, L.L.P.
ONE LANDMARK SQUARE, 10TH FLOOR
STAMFORD, CT 06901-2682

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