Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16769061
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Filing Dt:
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06/02/2020
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Publication #:
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Pub Dt:
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07/29/2021
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Inventors:
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Chengli LIU, Zixian CHEN, Haili WANG, Ming MA
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Title:
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FPGA CHIP WITH DISTRIBUTED MULTIFUNCTIONAL LAYER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19/F CTT, BUILDING A., NO. 66, BEISIHUANXILU, HAIDIAN DISTRICT |
| BEIJING, CHINA 100080 |
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| BUCHANAN INGERSOLL & ROONEY PC |
| P.O. BOX 1404 |
| ALEXANDRIA, VA 22313-1404 |
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