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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/05/2022
Application #:
16784435
Filing Dt:
02/07/2020
Publication #:
Pub Dt:
08/12/2021
Inventors:
Vinayak Shamanna, Lifang Xu, Aaron R. Wilson
Title:
Integrated Assemblies, and Methods of Forming Integrated Assemblies
Assignment: 1
Reel/Frame:
051749/0166Recorded: 02/07/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/23/2020
Exec Dt:
02/05/2020
Exec Dt:
01/29/2020
Assignee:
8000 SOUTH FEDERAL WAY, MS 1- 525
BOISE, IDAHO 83716
Correspondent:
WELLS ST. JOHN P.S.
601 W. MAIN AVENUE
SUITE 600
SPOKANE, WA 99201

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