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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16807075
Filing Dt:
03/02/2020
Publication #:
Pub Dt:
09/02/2021
Inventors:
Xiaopeng Qu, Eiichi Nakano, Hyunsuk Chun, Amy R. Griffin
Title:
THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AND METHODS
Assignment: 1
Reel/Frame:
051984/0849Recorded: 03/02/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/28/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Assignee:
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondent:
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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