Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16879028
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Filing Dt:
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05/20/2020
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Publication #:
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Pub Dt:
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09/02/2021
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Inventors:
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Ming-Yi WANG, Yu-Ping WANG
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Title:
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REDISTRIBUTION LAYER OF FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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| PATENTTM.US JAMES H. WALTERS |
| 205 SE SPOKANE ST STE 300 |
| PORTLAND, OR 97202-6487 |
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