Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17056340
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Filing Dt:
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11/17/2020
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Hyung Joon Cha, Eun Young Jeon, Jung Ho Lee, Geun Bae Lim
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Title:
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Microneedle Adhesive Patch Based on Hydrogel Formulation
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77, CHEONGAM-RO, NAM-GU |
| POHANG-SI |
| GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 37673 |
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| MARSHALL, GERSTEIN & BORUN LLP |
| 233 SOUTH WACKER DRIVE |
| SUITE 6300 |
| CHICAGO, IL 60606 |
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09/23/2024 03:17 AM
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