Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/17/2023
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Application #:
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16809689
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Filing Dt:
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03/05/2020
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Publication #:
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Pub Dt:
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09/09/2021
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Inventors:
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Frank G. Küchenmeister, Marcel B. Wieland, Hartmuth Daniel Kunze, Lothar E. Lehmann et al
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Title:
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INTEGRATED CIRCUIT STRUCTURE WITH DIELECTRIC MATERIAL TO COVER HORIZONTALLY SEPARATED METAL LAYERS, AND RELATED METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 309 |
| UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY, 4TH FLOOR |
| ALBANY, NY 12207 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WILSCHDORFER LANDSTRASSE 101 |
| DRESDEN, GERMANY 01109 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| 4TH FLOOR |
| ALBANY, NY 12207 |
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