Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/18/2022
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Application #:
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16819709
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Filing Dt:
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03/16/2020
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Publication #:
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Pub Dt:
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09/16/2021
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Inventors:
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Wu-Der YANG, Chun-Huang YU
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Title:
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THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE WITH PARTIALLY OVERLAPPING CHIPS AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.98, NANLIN RD., TAISHAN DIST. |
NEW TAIPEI CITY 243, TAIWAN |
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MUNCY, GEISSLER, OLDS & LOWE, P.C. |
4000 LEGATO ROAD, SUITE 310 |
FAIRFAX, VA 22033 |
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09/23/2024 12:45 AM
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