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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/03/2023
Application #:
17179432
Filing Dt:
02/19/2021
Publication #:
Pub Dt:
09/16/2021
Inventors:
Hyun Sik KIM, Yong Tae KWON, Hee Cheol KIM, Seung Hwan SHIN, Dong Hoon SEO, Dong Soo LEE
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
056090/0890Recorded: 04/30/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/26/2021
Exec Dt:
04/22/2021
Exec Dt:
04/22/2021
Exec Dt:
04/22/2021
Exec Dt:
04/22/2021
Exec Dt:
04/27/2021
Assignee:
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, 27651, REPUBLIC OF KOREA
SAMSEONG-MYEON, KOREA, REPUBLIC OF 27651
Correspondent:
GOKALP BAYRAMOGLU
1540 WEST WARM SPRINGS ROAD
SUITE 100
HENDERSON, NV 89014

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