Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16925032
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Filing Dt:
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07/09/2020
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Publication #:
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Pub Dt:
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09/16/2021
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Inventors:
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Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Ming Hung Tseng, Hung-Yi Kuo, Hao-Yi Tsai et al
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Title:
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Die Stacking Structure and Method Forming Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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05/29/2024 03:20 PM
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