Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/28/2023
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Application #:
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17243230
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Filing Dt:
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04/28/2021
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Publication #:
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Pub Dt:
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09/23/2021
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Inventors:
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Andrew Sherman, Haixong Tang
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Title:
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HIGH DENSITY FLUID FOR COMPLETION APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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24112 ROCKWELL DRIVE |
EUCLID, OHIO 44117 |
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ULMER & BERNE LLP |
1660 WEST 2ND STREET |
SKYLIGHT OFFICE TOWER, SUITE 1100 |
CLEVELAND, OH 44113 |
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11/11/2024 11:25 PM
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